| PCB production process capability | ||
| Number | Project | Content |
| 1 | Layers | Single-sided/double-sided/multi-layer (4-32 layers) |
| 2 | Material | Common: FR-4 (Medium TG High TG), CEM-1 Special: CEM-3, Rogers |
| 3 | Surface treatment process | Lead-free technology: lead-free HASL, immersion nickel gold, gold plating, organic solder protection film (OSP) |
| 4 | Special Process | 1. Impedance board (impedance requirement is within ±10%) |
| 2. High copper thick plate (copper thickness of inner and outer layers is 4-6 OZ) | ||
| 3. High TG board/halogen-free board/halogen-free high TG board | ||
| 5 | Processed plate thickness | 0.2-7mm |
| 6 | Processing size | Maximum processing size: 750MM X850MM |
| Minimum processing size: 5MM X 5MM | ||
| 7 | Minimum aperture | 0.1mm |
| 8 | Minimum line width and line spacing | Minimum line width: 0.075mm Minimum line spacing: 0.075mm |
| 9 | Plate Thickness Aspect Ratio | 1：8 within |
| 10 | Minimum annular ring | 0.2mm |
| 11 | Outer copper thickness | 18μm、35μm、70μm、 105μm、140μm |
| 12 | Solder mask oil film type | Liquid Photosensitive Solder Resist Ink |
| 13 | Solder resist ink color | Photosensitive series: green, black, red, yellow, white, blue, orange, etc. |
| Matt series: green, black | ||
| sun ink | ||
| 14 | Shape processing method | Die stamping、CNC |
| 15 | Tolerance | Line width ± 10%, aperture + 3Mil, shape processing ± 0.15MM (special process to be determined separately) |
| 16 | Coating thickness | 1. HASL: copper thickness 18-25um, tin thickness 5-40um |
| 2. Immersion gold plate: nickel thickness 2.5-5μm, gold thickness 0.05-0.1μm | ||
| 3. OSP board: film thickness 0.2-0.5um | ||
| 17 | Warpage | ≤0.75% |
| 18 | Total Capacity | 30000㎡ |
| PCBAssembly capability | ||
| Number | Project | Content |
| 1 | Solder type | Lead-Free (RoHS Compliant) |
| 2 | Assembly time | From 24 hours to 7 days once all parts are ready |
| 3 | Maximum size of PCB | 550*460*5mm |
| 4 | PCB minimum size | 50*50*0.8mm |
| 5 | Assembly type | Surface Mount (SMT) Assembly |
| 6 | Ball Grid Array (BGA) Assembly | |
| 7 | Mixed technology (SMT and through-hole) | |
| 8 | Through hole assembly | |
| 9 | Mixed assembly | |
| 10 | Maximum height of components | 15mm |
| 11 | Maximum size of components | 50*50*15mm |
| 12 | Assembly surface | single/double sided |
| 13 | SMT Total Capacity | 5 million points/day |
| 14 | DIP Total Capacity | 180000 points/day |
| 15 | ASSY Total Capacity | 200000 points/month |
| 16 | Quality inspection | Vision test |
| 17 | AOI | |
| 18 | X-RAY | |
| 19 | Online test | |
| 20 | Function test | |
| 21 | After-sales service | If defective or damaged during delivery, repair and rework services will be provided. Communication comes first. |
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